Object's details: Influence of Ceramic Particles on the Microstructure and Mechanical Properties of SAC305 Lead-Free Soldering Material
Provider:Czasopisma PAN
Description
- Title:
- Creator:
- Description:
- Object availability:
- Rights:
- Date:
- Type:
- Source:
- Coverage:
- Publisher:
- Subject:
- Identifier:
- Data provider:
- Can I use it?:
- Type:
Similar objects
Creator:Pal, Manoj Kumar | Gergely, G. | Koncz-Horvath, D. | Gacsi, Z.
Date:2019.06.27
Type:image
Creator:Koncz-Horváth, D. | Gergely, G. | Z. Gácsi
Date:2017
Type:other
The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
Creator:Koncz-Horváth, D. | Gergely, G. | Z. Gácsi
Date:2015
Type:other
Creator:Gergely, G. | Koncz-Horváth, D. | Weltsch, Z. | Z. Gácsi
Date:2017
Type:other
Creator:Koncz-Horváth, D. | Gergely, G. | Gyökér, Z. | Gácsi, Z.
Date:2019.09.03
Type:image
Creator:Sharma Manoj Kumar | Vig Renu | Pal Ravi | Shantharam Veena
Date:2018.06.15
Type:image
Creator:Varanasi, D. | Aldawoudi, K.E. | Baumli, P. | Koncz-Horvath, D. | Kaptay, G.
Date:2021.05.13
Type:image
Creator:Karácsony, Gergely G.
Date:2019.09.18
Type:other