Object's details: Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes

Provider:Czasopisma PAN

Description

Title:
Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes
Creator:
Bisewski, Damian;
Myśliwiec, Marcin;
Górecki, Krzysztof;
Kisiel, Ryszard;
Zarębski, Janusz
Description:
Metrology and Measurement Systems is an international journal, peer-reviewed, quarterly-published, launched in 1988. Since 2001 it has appeared in English. The journal is published both in the paper and electronic form on the Electronic Library platform, Polish Academy of Sciences. The Journal is indexed in Journal Citation Reports and Web of Science Master Journal List (Clarivate Analytics formerly Thomson Reuters), INSPEC, Scopus, Index Copernicus, Google Scholar, CSA Technology Research, High Tech Research Database, Solid State & Superconductivity. Impact Factor for 2022*: 1.0 Contributions are invited on all aspects of research, development and applications of the measurement science and associated technology. The list of topics covered includes: theory, general principles and applications of measurement; measurement of physical, chemical and biological quantities; medical measurements; sensors and transducers; measurement data acquisition; measurement signal transmission; processing and data analysis; measurement systems and embedded systems; design, manufacture and evaluation of measurement instrumentation. The average publication cycle is 6 months. *According to Journal Citation Reports;
Editorial Board Editor-in-Chief Ryszard SZPLET Military University of Technology, Poland e-mail: ryszard.szplet@wat.edu.pl Vice Editor-in-Chief Paweł KWIATKOWSKI Military University of Technology, Poland e-mail: pawel.kwiatkowski@wat.edu.pl Technical Editor and Webmaster Dominik SONDEJ Military University of Technology, Poland e-mail: dominik.sondej@wat.edu.pl Language Editor Andrzej ŁUKASZEWICZ Military University of Technology, Poland e-mail: andrzej.lukaszewicz@wat.edu.pl International Programme Committee Andrzej ZAJĄC, Chairman Military University of Technology, Poland Bruno ANDO University of Catania, Italy Martin BURGHOFF Physikalisch-Technische Bundesanstalt, Germany Marcantonio CATELANI University of Florence, Italy Numan DURAKBASA Vienna University of Technology, Austria Janusz GAJDA AGH University of Science and Technology, Poland Domenico GRIMALDI University of Calabria, Italy Laszlo KISH Texas A&M University, USA Juha KOSTAMOVAARA University of Oulu, Finland Eduard LLOBET Universitat Rovira i Virgili, Tarragona, Spain Alex MASON Liverpool John Moores University, The United Kingdom Subhas MUKHOPADHYAY Massey University, Palmerston North, New Zealand Janusz MROCZKA Wroclaw University of Science and Technology, Poland Antoni ROGALSKI Military University of Technology, Poland Wiesław WOLIŃSKI Warsaw University of Technology, Poland Associate Editors Sławomir CIĘSZCZYK Lublin University of Technology, Poland e-mail: s.cieszczyk@pollub.pl Albin CZUBLA Central Office of Measure, Poland e-mail: albin.czubla@gum.gov.pl Vladimir DIMCHEV Ss. Cyril and Methodius University, Macedonia e-mail: vladim@feit.ukim.edu.mk Krzysztof DUDA University of Science and Technology, Poland e-mail: kduda@agh.edu.pl Agnieszka IWAN Military University of Land Forces, Poland e-mail: agnieszka.iwan@awl.edu.pl Ireneusz JABŁOŃSKI Wrocław University of Science and Technology, Poland e-mail: ireneusz.jablonski@pwr.wroc.pl Jacek JAKUBOWSKI Military University of Technology, Poland e-mail: jacek.jakubowski@wat.edu.pl Jussi-Pekka JANSSON University of Oulu, Finland e-mail: jussi.jansson@oulu.fi Mieczysław JESSA Poznan University of Technology, Poland e-mail: mieczyslaw.jessa@put.poznan.pl Piotr KANIEWSKI Military University of Technology, Poland e-mail: piotr.kaniewski@wat.edu.pl Piotr KISAŁA Lublin University of Technology, Poland e-mail: p.kisala@pollub.pl Manoj KUMAR Jaypee Institute of Information Technology, Uttar Pradesh, India e-mail: my.hunn.manoj@gmail.com Grzegorz LENTKA Gdańsk University of Technology, Poland e-mail: lentka@eti.pg.edu.pl Czesław ŁUKIANOWICZ Koszalin University of Technology, Poland e-mail: czeslaw.lukianowicz@tu.koszalin.pl Rosario MORELLO University Mediterranean of Reggio Calabria, Italy e-mail: rosario.morello@unirc.it Petr SEDLAK Brno University of Technology, Brno, Czech Republic e-mail: sedlakp@feec.vutbr.cz Tadeusz SONDEJ Military University of Technology, Poland e-mail: tadeusz.sondej@wat.edu.pl Mirosław SZMAJDA Opole University of Technology, Poland e-mail: m.szmajda@po.edu.pl Michał STRZELECKI Lodz University of Technology, Poland e-mail: michal.strzelecki@p.lodz.pl Grzegorz ŚWIRNIAK Wrocław University of Technology, Poland e-mail: grzegorz.swirniak@pwr.wroc.pl Michał WIECZOROWSKI Poznan University of Technology, Poland e-mail: jmichal.wieczorowski@put.poznan.pl Jacek WOJTAS Military University of Technology, Poland e-mail: jacek.wojtas@wat.edu.pl
Object availability:
free access
Rights:
Metrology and Measurement Systems jest czasopismem wydawanym w wolnym dostępie na licencji CC BY-NC-ND 4.0. <a href=" https://creativecommons.org/licenses/by-nc-nd/4.0/"> https://creativecommons.org/licenses/by-nc-nd/4.0/</a></p>Metrology and Measurement Systems is an open access journal with all content available with no charge in full text version. The journal content is available under the licencse CC BY-NC-ND 4.0 <a href=" https://creativecommons.org/licenses/by-nc-nd/4.0/"> https://creativecommons.org/licenses/by-nc-nd/4.0/</a>.
Date:
2016.09.30
Type:
Artykuły / Articles
Source:
Metrology and Measurement Systems; 2016; vol. 23; No 3; 451-459
Coverage:
451-459
Publisher:
Polish Academy of Sciences Committee on Metrology and Scientific Instrumentation
Subject:
Schottky diodes;
transient thermal impedance;
thermal measurements;
Silicon carbide;
packaging;
Nauki Techniczne
Identifier:
ISSN 2080-9050, e-ISSN 2300-1941
Data provider:
Czasopisma PAN

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Object's details: Examinations of Selected Thermal Properties of Packages of SiC Schottky Diodes

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